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Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International

召开年：1988
召开地：Lake Buena Vista, FL
出版时间：-

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1.Hybrid substrate testing

机译：混合基板测试
- 作者：Crowley D.F.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
2.Knowledge acquisition of manufacturing descriptions

机译：制造描述的知识获取
- 作者：Chapman W.M.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
3.Manufacturability tools: an engineer's use and needs

机译：可制造性工具：工程师的使用和需求
- 作者：Conradson S.A.;Barford L.A.;Fisher W.D.;Weinstein M.J.;Wilker J.D.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
4.Manufacturing control systems design for ASIC manufacturing

机译：ASIC制造的制造控制系统设计
- 作者：Brain M.D.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
5.Thermal processing of labile materials: a kinetic approach

机译：不稳定材料的热处理：动力学方法
- 作者：Ziger D.H.;Wolk G.L.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
6.Thermocompression joining of copper to copper for TAB

机译：TAB铜与铜的热压连接
- 作者：Sajja V.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
7.Automated hybrid package sealing system

机译：自动混合包装密封系统
- 作者：Doherty J.G.;McGinn T.M.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
8.Design and fabrication process of 800 MHz band low loss SAW filter

机译：800 MHz频带低损耗SAW滤波器的设计与制造过程
- 作者：Sakamoto N.;Huor O.H.;Kasagi M.;Shibata S.;Nihei K.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
9.Design for manufacturability in hermetic product die attach

机译：密封产品管芯附接中的可制造性设计
- 作者：Owens N.L.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
10.Planning for production of a set of components when yield is random

机译：当产量随机时，计划生产一组零件
- 作者：Singh M.R.;Abraham C.T.;Akella R.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
11.Surface mount technology based on a new aramid/epoxy laminate

机译：基于新型芳纶/环氧树脂层压板的表面贴装技术
- 作者：Tsunashima E.;Okuno A.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
12.Building the bridge between design and manufacturing

机译：搭建设计与制造之间的桥梁
- 作者：Correia M.;Freeman W.J. III
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
13.SMT statistical process control using automatic X-ray inspection

机译：使用自动X射线检查的SMT统计过程控制
- 作者：Hudzik J.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
14.The product release interface: environment and concerns

机译：产品发布界面：环境和关注点
- 作者：Purssell R.A.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
15.Electronic packaging: a systems approach to radiation curing

机译：电子包装：辐射固化的系统方法
- 作者：Gutek B.I.;Strong M.R.;Shirk C.C.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年
16.Analysis of printed wiring board assembly systems

机译：印刷电路板组装系统分析
- 作者：Driels M.R.;Klegka J.S.
- 会议名称：《Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle'. Fifth IEEE/CHMT International》 | 1988年