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A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation

机译:完全集成的片上电感数字隔离器:设计调查和仿真

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This work presents the implementation and simulation of a fully integrated on-chip inductive digital isolation system in AMS 0.35 µm CMOS process. The aim of this work is to investigate the transformer design of the isolation barrier in a digital isolator system. Firstly, both capacitive and inductive coupling techniques are presented and compared in terms of effective area, power consumption and propagation delay. Then, a transformer-based inductive digital isolator system chip prototype is presented using two different customized transformer designs. The on-chip transformer’s secondary coil is implemented in first metal layer (M1), whereas the primary coil is constructed on metal 2 (M2) and metal (M3) in order to examine the system functionality and isolation capability. The system occupies 2 mm2 of silicon area and achieves approximately a 15 ns propagation delay for a 15 MHz input pulse-width modulated (PWM) signal.
机译:这项工作介绍了在AMS 0.35 µm CMOS工艺中完全集成的片上电感数字隔离系统的实现和仿真。这项工作的目的是研究数字隔离器系统中隔离栅的变压器设计。首先,介绍了电容和电感耦合技术,并在有效面积,功耗和传播延迟方面进行了比较。然后,使用两种不同的定制变压器设计,提出了基于变压器的电感式数字隔离器系统芯片原型。片上变压器的次级线圈在第一金属层(M1)中实现,而初级线圈在金属2(M2)和金属(M3)上构建,以便检查系统功能和隔离能力。系统占地2毫米 2 对于15 MHz的输入脉冲宽度调制(PWM)信号,可实现约15 ns的传输延迟。

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