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Expanding DSA process window with atmospheric control

机译:通过大气控制扩展DSA过程窗口

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Directed Self Assembly (DSA) is a promising technology for complementary patterning in future nodes. As DSA patterning has continued to evolve there has been many efforts to improve defect performance using hardware, processes, and materials. Traditionally, in PS-b-PMMA block-copolymers (BCP) based patterning schemes, phase separation is achieved using a thermal annealing with controlled temperature and time. In previous work we have expanded our understanding of BCP annealing by demonstrating the ability to improve a process window and fingerprint formation of a lamellar system (31nm pitch BCP) by atmospheric condition control during the thermal anneal, as shown in Figure 1. By reducing the oxygen concentration inside the annealing chamber, we have demonstrated improved densities for fingerprint defects commonly associated with phase separation in BCP systems. Furthermore, by achieving a strong regulation of the concentration at different levels, we have achieved a better understanding of what might be required to fully eliminate these defects for subsequent studies and learning toward device manufacture. By reducing the concentration of oxygen during the thermal anneal process, we have been able to employ noticeably higher annealing temperatures without damaging the BCP films. Ultimately, our goal is to provide an annealing solution that is amenable to high volume manufacturing. In this study, controlled oxygen annealing of a 31nm pitch BCP is evaluated against a known thermal annealing baseline. Oxygen concentration, temperature and time are finely tuned in the study. Finally, polymers with different compositions (ie morphologies: lamellar, PS cylinders, PMMA cylinders) are evaluated, and the correlation between thermal budget and polymer stability is reported.
机译:定向自组装(DSA)是一种有前途的技术,可用于将来节点中的互补构图。随着DSA图案的不断发展,人们已经进行了许多努力来使用硬件,工艺和材料来改善缺陷性能。传统上,在基于PS-b-PMMA嵌段共聚物(BCP)的图案化方案中,使用具有受控温度和时间的热退火可实现相分离。在先前的工作中,我们展示了通过在热退火过程中通过大气条件控制来改善层状系统(31nm间距BCP)的工艺窗口和指纹形成的能力,从而扩展了对BCP退火的理解,如图1所示。退火室内的氧气浓度,我们已经证明了BCP系统中通常与相分离有关的指纹缺陷的密度提高了。此外,通过对不同浓度下的浓度进行强有力的调节,我们对完全消除这些缺陷所需的条件有了更好的理解,以供后续研究和学习器件制造。通过在热退火过程中降低氧气的浓度,我们已经能够采用明显更高的退火温度而不会损坏BCP膜。最终,我们的目标是提供适合大批量生产的退火解决方案。在这项研究中,对照已知的热退火基线评估了31nm间距BCP的受控氧退火。这项研究对氧气浓度,温度和时间进行了微调。最后,评估了具有不同组成(即形态:层状,PS圆柱,PMMA圆柱)的聚合物,并报道了热收支与聚合物稳定性之间的相关性。

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