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Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry

机译:半导体制造中的订单下达方法:最新科学技术和行业经验教训

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This contribution presents an industry case study as well as an analysis of the state-of-the-art in science concerning order release methods in wafer manufacturing in the semiconductor industry. The release of orders into the fab significantly influences critical parameters such as WIP, cycle time and throughput. We examine the processes currently applied in industry, indicate the effects of this order release approach on the performance of high-mix, high-volume fabs and establish a link to the analyzed scientific literature to develop a concept for meaningful automation of the release decision.
机译:这一贡献提出了一个行业案例研究,并分析了有关半导体行业晶圆制造中的订单释放方法的科学最新进展。向工厂下达订单会显着影响关键参数,例如在制品,周期时间和吞吐量。我们研究了当前在工业中应用的流程,指出了这种订单发布方式对高混合,大批量晶圆厂性能的影响,并建立了与已分析的科学文献的链接,以开发出有意义的自动化发布决定的概念。

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