Investigation of a seesaw structure for elevating the micro-optical device by CMOS-MEMS process

摘要

The paper proposed a novel seesaw structure for elevating the micro optical device by the driving force of micro array thermal actuator, MATA. The effects of elevating structure, lateral connection arm structure, immobile structure and width of vertical connection arm on the maximum displacements and the variation of surface flatness of the elevated micro mirror surface varied with operation voltage are investigated. The motion behavior of the elevated micro mirror is stimulated and analyzed to get the maximum displacement and inclined angle of the device. The results demonstrate a pair of {1 x 2} parallel type MATA for the elevating structure, simple beam for the lateral connection arm structure, single thermal actuator for the immobile structure and 10μm for width of vertical connection arm are the optimum design for the micro optical device. The maximum displacement and inclined angle of the proposed micro optical device are 34.7μm and 10o, respectively. The device is fabricated by Taiwan Semiconductor Manufacture Cooperation, TSMC 0.35μm 2P4M mixed signal model, based upon CIC CMOS-MEMS process. The paper will examine whether CIC CMOS-MEMS could fully support to fabricate the integrated component for MOEMS.