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System integration of hybrid large aperture Micro Scanner Array for fast scanning LiDAR sensors

机译:混合大孔径微扫描仪阵列快速扫描激光扫描器的系统集成

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This article presents the design and system integration of a hybrid MEMS scanner array (MSM) developed for a real time 3D imaging with a panoramic optical field of view (FOV) of 360° × 60° (horizontal × vertical). The pulsed ToF LiDAR system targets on a distance measurement range of 100 m with a video-like frame rate of 10 Hz. The fast vertical scan axis is realized by a synchronous scanning MSM array with large receiver aperture. It increases the scanning rate to 3200 Hz, which is four times faster in comparison to state-of-the-art fast macroscopic polygon scanning systems used in actual LIDAR systems. A hybrid assembly of frequency selected scanner elements was chosen instead of a monolithic MEMS array to guaranty high yield of MEMS fabrication and a synchronous operation of all resonant MEMS elements at 1600 Hz with large FOV of 60°. The hybrid MSM array consists of a separate emitting mirror for laser scanning of the target and 22 reception elements resulting in a large reception aperture of D_(eff) = 23mm. All MSM are driven in parametric resonance to enable a fully synchronized operation of all individual MEMS scanner elements. Therefore, piezo-resistive position sensors are integrated inside the MEMS chip used for position feedback of driving control. The paper focus on the MEMS system integration including the synchronized operation of multiple MEMS scanning elements. It presents technical details to meet the narrow tolerance budgets for (ⅰ) micro assembly and (ⅱ) synchronous driving of multiple MEMS scanner elements.
机译:本文介绍了用于实时3D成像的混合MEMS扫描仪阵列(MSM)的设计和系统集成,其中360°×60°(水平×垂直)的全景光学视野(FOV)。脉冲TOF LIDAR系统距离测量范围为100米,视频帧速率为10 Hz。快速垂直扫描轴通过具有大接收器孔径的同步扫描MSM阵列实现。它将扫描速率提高到3200Hz,与实际激光雷达系统中使用的最先进的快速宏观多边形扫描系统相比,扫描速率是较快的。选择频率选择的频率选择的混合组件,而不是单片MEMS阵列,以确保高产MEMS制造和在1600Hz的所有谐振MEMS元件的同步操作,其具有60°的大FOV。混合MSM阵列由单独的发射镜组成,用于激光扫描目标和22个接收元件,导致D_(EFF)= 23mm的大接收孔径。所有MSM都以参数谐振驱动,以实现所有单独的MEMS扫描仪元素的完全同步操作。因此,压电位置传感器集成在MEMS芯片内部,用于用于驱动控制的位置反馈。本文侧重于MEMS系统集成,包括多个MEMS扫描元素的同步操作。它提出了技术细节,以满足(Ⅰ)微组件的窄公差预算和多个MEMS扫描仪元件的同步驱动。

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