Thermodynamic and kinetic factors governing wetting of oxidized and deoxidized Cu surfaces by liquid Sn

摘要

In this work we study the isothermal wetting and spreading kinetics of liquid Sn on oxidized and deoxidized Cu surfaces. The thickness of the oxide layer over the Cu substrate varied between about 5 nm and 1 μm. The final contact angles and spreading kinetics on oxidized surfaces are compared with those on deoxidized Cu as well as on interfacial reaction product Cu6Sn5. The role of the oxide layer on the spreading kinetics and final contact angle as well as the mechanisms of reactive wetting are discussed.