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Analysis and Research on Thermal-Force Coupling Performance of a Vehicle Controller PCB Board

机译:车辆控制器PCB板热力耦合性能分析研究

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摘要

Based on the basic theory of thermodynamics and finite element, taking PCB of as the research object of a vehicle controller, the thermal characteristics and structural mechanics simulation are carried out. The distribution of temperature, thermal stress and deformation and thermal-force coupling performance of PCB are obtained, so as to provide a reference for the design optimization of the subsequent circuit board, the selection of heat dissipation mode and the installation position.
机译:基于热力学和有限元的基本理论,以PCB作为汽车控制器的研究对象,进行了热特性和结构力学仿真。得到了PCB的温度分布,热应力和变形以及热力耦合性能,为后续电路板的设计优化,散热方式的选择和安装位置提供参考。

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