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Soft-Switching Losses in GaN and SiC Power Transistors Based on New Calorimetric Measurements

机译:基于新量热测量的GaN和SiC功率晶体管中的软开关损耗

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The use of modern GaN and SiC power semiconductors in soft-switching power electronic applications makes it possible to minimize switching losses and to achieve a significant increase in power density. However, the loss mechanisms in soft-switching operation of power semiconductors are poorly under-stood and electrical measurements of these losses are affected by a large error. Therefore calorimetric measuring methods are becoming state of the art for determining soft-switching losses. This paper for the first time presents empirical power dissipation data for high voltage GaN and SiC power semiconductors of low power class at application-oriented switching frequencies for zero voltage switching (ZVS) operation. The losses were measured using a transient calorimetric measurement setup with the goal of determining also low power dissipation with high accuracy while maintaining the application-oriented commutation cell layout.
机译:在软开关功率电子应用中使用现代的GaN和SiC功率半导体,可以最大程度地降低开关损耗并显着提高功率密度。但是,功率半导体的软开关操作中的损耗机制了解得很差,并且这些损耗的电气测量会受到较大误差的影响。因此,量热测量方法已成为确定软开关损耗的最新技术。本文首次展示了在零电压开关(ZVS)操作的面向应用的开关频率下,低功率类别的高压GaN和SiC功率半导体的经验功耗数据。损耗是使用瞬态量热测量设置测量的,目的是在保持面向应用的换向单元布局的同时,高精度确定低功耗。

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