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SiC and GaN power transistors switching energyudevaluation in hard and soft switching conditions

机译:SiC和GaN功率晶体管的开关能量 ud硬切换和软切换条件下的评估

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摘要

SiC and GaN power transistors switching energy are compared in this paper. In order to compare switching energy Esw of the same power rating device, a theoretical analysis is given to compare SiC device conduction loss and switching losses change when device maximal blocking voltage reduces by half. After that, Esw of a 650V GaN-HEMT is measured in hard switching condition and is compared with that of a 1200V SiC-MOSFET and a 650V SiC-MOSFET with the same current rating, in which it is shown that Esw of a GaN-HEMT is smaller than a 1200V SiC-MOSFET, which is smaller than 650V SiC-MOSFET. Following by that, in order to reduce device turn-ON switching energy, a zero voltage switching circuit is used to evaluate all the devices. Device output capacitance stored energy Eoss are measured and turn-OFF switching losses are obtained by subtracting Eoss, which shows that GaN-HEMT is sill better than SiC device in terms of switching losses and 1200V SiC-MOSFET has smaller switching losses than 650V SiC-MOSFET.
机译:本文比较了SiC和GaN功率晶体管的开关能量。为了比较同一额定功率器件的开关能量Esw,进行了理论分析以比较SiC器件的导通损耗和器件最大阻断电压降低一半时开关损耗的变化。然后,在硬开关条件下测量650V GaN-HEMT的Esw,并将其与具有相同额定电流的1200V SiC-MOSFET和650V SiC-MOSFET的Esw进行比较,结果表明GaN-HEMT的Esw HEMT小于1200V SiC-MOSFET,后者小于650V SiC-MOSFET。接下来,为了减少设备导通的开关能量,使用零电压开关电路评估所有设备。测量器件输出电容存储的能量Eoss,并减去Eoss,获得关断开关损耗,这表明GaN-HEMT在开关损耗方面比SiC器件更好,并且1200V SiC-MOSFET的开关损耗小于650V SiC- MOSFET。

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