Ultra-Low CTE Polyimide Film for Flexible Substrates

摘要

A requirement has been increasing for new plastic film which has more heat resistance and low thermal expansion for flexible Thin Film Transistor (TFT) substrate. We succeeded in development of a novel polyimide film having ultra-low CTE, 3 ppm/K, which is almost equal to that of low-CTE glass and silicon, high heat resistance and flat surface suitable for flexible TFT substrates. Furthermore, we developed a novel film handling technique which can fix polyimide film on low-CTE glass substrate without binder. It keeps its bonding up to 450°C and also possible mechanical peeling after TFT process.