Oxidation-resistant Cu-Ag Core-shell Nanoparticle Paste for High Temperature Electronic Packaging

摘要

To meet the requirements of high temperature and high reliability of the third generation semiconductors, an oxidation-resistant Cu-Ag coreshell nanoparticle (NP) paste was developed in this work. The core-shell NPs with average particle diameter of 86.15 nm and silver (Ag) shell thickness of 6.8 nm were synthesized by reduction method. The antioxidation of NPs was investigated through x-ray diffraction and x-ray photoelectron spectroscopy. After sintering at 300 °C for 30 min, the shear strength of Cu- Cu joint can be achieved to 19.7 MPa under a low bonding pressure. The fracture microstructures of bonded joints were exhibited obvious ductile characteristics. These results manifested the Cu-Ag core-shell NPs have the potential to fulfill the requirements of die-attach material for power device packaging.