首页> 外文会议>International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems >Advanced Mixed-Mode Bending Test: Influence of the Surface Topography on the Fracture Behavior of an EMC to Copper Lead Frame Bi-Material Interface
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Advanced Mixed-Mode Bending Test: Influence of the Surface Topography on the Fracture Behavior of an EMC to Copper Lead Frame Bi-Material Interface

机译:先进的混合模式弯曲测试:表面形貌对EMC到铜引线框架双材料界面的断裂行为的影响

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摘要

In this paper, a hypothesis is further investigated which states the dependence of fracture toughness on the orientation of the crack opening to the topography of the surface of the lead frame which forms the interface with the EMC. Additionally, the size effect of the specimen width is investigated as well.A test series using the Advanced Mixed Mode Bending method was performed using eight samples. The samples are bi-material beams which are extracted from a mold map. The sample width was varied as well as the orientation of the beam according to the topography of the lead frame. The samples are destructively tested and the measured sensor and image data are then used in a finite element analysis. A new algorithm is introduced which utilizes a digital image correlation software to extract the displacement fields from the recorded images of the beam flank. The simulation results in form of the critical energy release rate Gc versus the corresponding mode mixity ψ of the eight samples are than analyzed to test the hypothesis of the orientation and the effect of the sample width as alias of the size effect.
机译:在本文中,进一步研究了一个假设,该假设陈述了断裂韧性与裂纹开口方向与引线框架表面形貌的相关性,引线框架表面形成了与EMC的界面。此外,还研究了样品宽度的尺寸效应。使用高级混合模式弯曲方法对八个样品进行了一系列测试。样本是从模具图提取的双材料梁。根据引线框的形貌,样品的宽度以及光束的方向都不同。对样品进行破坏性测试,然后将测得的传感器和图像数据用于有限元分析。引入了一种新算法,该算法利用数字图像相关软件从光束侧面记录的图像中提取位移场。然后,以临界能量释放速率Gc相对于八个样品的相应模式混合度ψ的形式对仿真结果进行了分析,以测试取向的假设以及作为宽度效应的别名的样品宽度的效应。

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