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Failure Modes of Flexible Electronics Under Mechanical Vibration

机译:机械振动下柔性电子的失效模式

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The use of flexible electronic components has increased considerably, and a study on the different vibration profiles for different fixtures and loads are of great importance in determining the conditions required to evaluate the reliability of flexible boards. Hence, in this study the behavior of flexible electronic circuit boards under different acceleration levels of vibration and with different fixtures are investigated. The vibration amplitudes of the flexible board at different locations are calculated from the strain gauge measurements from those respective locations. Further the change in the strain measurements at a location of the board is compared for different acceleration levels of vibration and for different type of fixture used during vibration. To study the change in behavior of the flexible board during the up-sweep and down-sweep vibration profiles, strain measurements at each location for up-sweep and down-sweep profiles were analyzed based on frequency and statistical characteristics of the signal. The variation of maximum amplitude at a location during the upsweep and down sweep vibration profile of the shaker frequency is also studied for all conditions of acceleration levels and for different fixtures. A comparative study on the flexible board vibration signals and a rigid board at the same vibration levels and location were also carried out to find the similarities and differences in the behavior of both. Frequency and time-frequency information of the strain signals were also analyzed and change in the occurrence of frequency components for upsweep and down sweep vibration profiles were studied for different fixtures and acceleration loads. A detailed analysis on the failure of flexible circuits for different fixtures and for different acceleration levels were also conducted to determine the optimum fixture for vibration at various vibration levels. This will also help in designing different types of fixtures for different levels of vibration and for minimizing the maximum amplitude vibrations for each fixture.
机译:柔性电子元件的使用已大大增加,对于确定不同夹具和负载的不同振动曲线的研究对于确定评估柔性板可靠性所需的条件非常重要。因此,在这项研究中,研究了柔性电子电路板在不同振动加速度水平和不同夹具下的行为。挠性板在不同位置的振动幅度是根据相应位置的应变仪测量值计算得出的。此外,针对不同的加速度加速水平和振动期间使用的不同类型的夹具,比较了板在某个位置处的应变测量值的变化。为了研究柔性板在上扫描和下扫描振动曲线期间的行为变化,基于信号的频率和统计特性分析了上扫描和下扫描曲线在每个位置的应变测量。还针对所有加速度水平条件和不同固定装置,研究了振动器频率的上扫和下扫振动曲线期间某个位置的最大振幅变化。还对相同振动水平和位置的柔性板振动信号和刚性板进行了比较研究,以发现两者在性能上的异同。还分析了应变信号的频率和时频信息,并研究了不同夹具和加速度载荷下上扫和下扫振动曲线的频率分量的发生变化。还对不同夹具和不同加速度等级的柔性电路的故障进行了详细分析,以确定在各种振动等级下振动的最佳夹具。这也将有助于设计用于不同水平振动的不同类型的固定装置,并使每个固定装置的最大振幅振动最小化。

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