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Transient Thermal Compact Models Time Integration with Python

机译:瞬态热紧凑模型与Python的时间集成

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摘要

Virtual prototyping is the way forward to shorten development cycles and deliver optimized design solutions for semiconductor components and electronic modules. It allows us to make virtual experiments for devices that have never been built before. We can predict safe operating areas and on the other hand identify critical use conditions. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains (e.g. thermal, electrical, mechanical)along with complex 3-D structures. The focus of the current paper is to present an efficient simulation flow for prediction of three-dimensional temperature fields at transient operating conditions with multiple heat sources and associated thermal cross talk at component and system levels. In what follows, we will demonstrate the virtual assembly of an electronic control unit (ECU)and its transient thermal simulation in time domain. We will decompose the unit into its major components for which fast mathematical models will be derived by means of model order reduction techniques. We will then create a reduced mathematical model of the entire ECU by simply interconnecting all components models at predetermined IO/s. We will demonstrate a stimulus-response analysis of the interconnected system and a subsequent result expansion path for 3-D visualization of temperature fields. Finally, we will compare simulation results of the reduced system model with the corresponding full-scale finite element model.
机译:虚拟样机是缩短开发周期并提供针对半导体组件和电子模块的优化设计解决方案的方法。它使我们可以对从未构建过的设备进行虚拟实验。我们可以预测安全的操作区域,另一方面可以确定关键的使用条件。虚拟样机的关键要求是有效且准确的仿真模型,该模型确实考虑了多个物理域(例如热,电,机械)以及复杂的3D结构。本文的重点是提出一种有效的仿真流程,用于预测瞬态运行条件下的三维温度场,该瞬态条件下具有多个热源以及相关的组件和系统级热串扰。接下来,我们将演示电子控制单元(ECU)的虚拟装配及其时域瞬态热仿真。我们将把单元分解成主要组成部分,通过模型降阶技术,可以快速得出数学模型。然后,我们将通过简单地以预定IO / s互连所有组件模型来创建整个ECU的简化数学模型。我们将演示互连系统的刺激响应分析,以及用于温度场3-D可视化的后续结果扩展路径。最后,我们将简化系统模型的仿真结果与相应的全尺寸有限元模型进行比较。

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