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Gate Oxide Process for III-V / Si Hybrid MOS Capacitor Modulator

机译:III-V / Si混合MOS电容器调制器的栅极氧化工艺

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摘要

Progresses in Photonic Integrated Circuits (PICs) demand development of high performance photonic devices, including phase modulators. Capacitive phase modulators present high efficiency and low consumption, at the cost of technical challenges for their integration in PICs. A 200mm wafer process flow for thin gate oxide employed for MOSCAP modulators fabrication is presented here.
机译:光子集成电路(PIC)的进步要求开发高性能光子器件,包括相位调制器。电容式相位调制器具有高效率和低功耗的特点,但集成在PIC中却面临技术挑战。本文介绍了用于MOSCAP调制器制造的薄栅极氧化物的200mm晶圆工艺流程。

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