Atomistic Investigation on Diffusion Bonding between Al and Ni using Molecular Dynamics Simulation

摘要

This paper presents an investigation on the effect of joining time on the diffusion bonding of Al and Ni. Employing molecular dynamics simulation, this study has succeeded to investigate the effect of holding time on the weld joint. The different levels of holding time have shown effect on the structural configuration and the tensile behavior. As the holding time is longer, the interfacial region become thicker. However, the thickness of interfacial region is not always determining the quality of weld joints, which confirmed by the lower tensile strength if the holding time is too long, since it produces more defects and deformation, instead of better joint. Holding time of 250 ps has shown a decrease in the weld joints quality, while optimum tensile strength is achieved with 200 ps. However, if the holding time is too short, deformation during tensile test become more randomly occurs. With holding time of 100 ps, most of Al slab has been deformed on the final step of tensile test.