Large-diameter optical components are important parts of the high-power laser facility, and generally have a diameter greater than 400 mm × 400 mm. It is important for the detection of the surface and internal characteristics of large-diameter optical components. Since large-diameter optical components have a large imaging range and a certain thickness (generally over 50 mm), how to achieve high-resolution imaging over the entire thickness of large-diameter optical components becomes a challenge. This paper proposes to use medium format CMOS to realize large field microscopy imaging to ensure that the imaging range meets the field of view requirements of large aperture optical components. At the same time, a microscopic imaging lens with a magnification of 1.5 is designed to ensure that the object resolution is 4.5 μm. Simulation experiments show that the system takes advantage of microscopic imaging, wavefront coding, and medium-format large targets. The imaging system can clearly image the entire large-diameter optical component over a long depth of field, improving the detection efficiency and detection accuracy of large-diameter optical components.
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