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Front-End Integrated Circuits for Readout of Large Area SiPMs at Cryogenic Temperature

机译:低温下用于大面积SiPM读出的前端集成电路

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This work describes the architecture and transistor-level design of CMOS front-end amplifiers for the readout of large area SiPMs at LAr temperature (87K). Two circuit topologies, based on trans-impedance and common-gate input stages, are discussed and compared. Both circuits were designed using a standard CMOS 110nm technology, and the simulation results obtained with the foundry PDK are presented. The circuits use a power rail of +1.25 V and −1.25 V, and a power budget below 100 mW, for a total gain of 58 dB. The target sensor is a 24cm2 SiPM tile developed in the framework of the Darkside Collaboration. Post-layout simulations with a cryogenic SiPM electrical model indicate that a signal-to-noise ratio above 8 and a jitter better than 15 ns should be achieved for a single photoelectron.
机译:这项工作描述了用于在LAr温度(87K)下读取大面积SiPM的CMOS前端放大器的体系结构和晶体管级设计。讨论并比较了基于互阻和共栅输入级的两种电路拓扑。两种电路均使用标准的CMOS 110nm技术进行设计,并给出了用代工厂PDK获得的仿真结果。电路使用+1.25 V和-1.25 V的电源轨,以及低于100 mW的功率预算,总增益为58 dB。目标传感器为24厘米 2 在Darkside协作框架内开发的SiPM磁贴。具有低温SiPM电气模型的布局后仿真表明,对于单个光电子,应实现高于8的信噪比和优于15 ns的抖动。

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