Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

摘要

Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.