Wafer level low temperature bonding of industrial glass substrates for life science

摘要

For the fabrication of life science components from structured glass, we have introduced low temperature direct and UV-adhesive bonding at 200 mm wafer level. We performed the annealing of direct bonded substrates at temperatures ranging from 200 °C to 350 °C for allowing the preservation of metal structures at the wafer surfaces. The UV-adhesive compound is biocompatible allowing for embedding of biomaterials at room temperature, such as structured immobilization chemistry within a microfluidic network. The intermediate adhesive layer makes this bonding technology insensitive to surface roughness and allows integration of shallow metal structures at the bond interface.