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Investigating the impact of on-chip interconnection noise on Dynamic Thermal Management efficiency

机译:调查片上互连噪声对动态热管理效率的影响

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Dynamic Thermal Management (DTM) emerged as a solution to address the reliability challenges with thermal hotspots and unbalanced temperatures. DTM efficiency is highly affected by the accuracy of the temperature information presented to the DTM manager. This work aims to investigate the effect of inaccuracy caused by the deep sub-micron (DSM) noise during the transmission of temperature information to the manager on DTM efficiency. A simulation framework has been developed and results show up to 38% DTM performance degradation and 18% unattended cycles in emergency temperature under DSM noise. The finding highlights the importance of further research in providing reliable on-chip data transmission in DTM application.
机译:动态热管理(DTM)作为解决可靠性挑战的解决方案,以解决热热点和不平衡的温度。 DTM效率受到DTM管理器呈现的温度信息的准确性的高度影响。这项工作旨在调查在DTM效率的经理在温度信息传输期间深度子微米(DSM)噪声引起的不准确性的影响。已经开发了模拟框架,结果显示出高达38%的DTM性能下降和DSM噪声下应急温度的18%无人值守循环。该发现突出了进一步研究在DTM应用中提供可靠的片上数据传输的重要性。

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