Thermal Error Analysis and Compensation of Die Attach Equipment for Fan-out Package

摘要

The large panel level Fan-out can reduce costs and have high reliability, which has become the mainstream form of advanced packaging. Die attach is a key process for large panel level Fan-out. Accurately align the chips on a large panel affects the success or failure of subsequent rewiring processes. The high-speed and high-precision die attaching process of Fan-out requires higher requirements for the structural design and motion control of the die attach equipment. The motor and the friction pair will generate heat during high-speed movement and the structural deformation caused by thermal stress has a significant effect on the accuracy of the die attach. In this paper, the heat transfer type of Fan-out die attach equipment is firstly analyzed, the heat transfer equation is determined. Then the thermal error analysis model is established, the mapping relationship between temperature field and thermal error is analyzed. Finally the thermal error compensation model is established to realize thermal error suppression and compensation for die attach equipment. The simulation results show that the heat-compensated lamination accuracy can controlled within 10μm, satisfying the requirements of the Fan-out process.