The study of MLCC assembly Reliability based on PCB strain measurement

摘要

In this paper, based on the printed circuit board(PCB) strain measurement technique, the relationship between the ultimate tolerance stress of a specific specification multi-layer ceramic capacitor (MLCC) and the PCB strain was studied by the bending test of the printed circuit board assembly(PCBA). In order to verify the correctness of the bending test conclusion, a new type PCBA was assembled, the simulation assembly test, environmental test were made for the PCBA and the metallographic analysis is made for the MLCC. The conclusions indicate that the strain of the PCBA around the MLCC less than 550ppm is a reliable boundary range.