The Research of Application Reliability and Failure Modes of Wire Bonding Process

摘要

Gold wire bonding is one of the key technologies in high-reliability packaging process, and widely used in electronic components required high reliability. This paper studied the typical process and reliability control methods of gold wire bonding, analyzed the effect of parameters such as bond power, bond time and bond force on bonding quality, and then further studied the typical failure modes and failure causes such as cracks in the neck, pad corrosion, bond pits and purple plague.