Application of Three-Dimensional X-Ray Microscopy in Failure Analysis for Sealed Relay

摘要

Sealed relay as a kind of switch component is widely used in communication, control and power protection system because of its mature process, convenient application. The sealed relay’s reliability becomes the focus, which affect the quality and reliability of the whole electronic system. In order to improve the reliability of sealed relay, failure analysis and destructive physical analysis are more and more important. Nowadays, three-dimensional (3D) X-ray microscopy as a non- destructive method is extensively applied in failure analysis of electronic components. In this paper, the principle of 3D X-ray microscopy and the common failure modes of sealed relay were introduced briefly. Moreover, the application of 3D X-ray microscopy in failure analysis for sealed relay was presented. The internal structure of sealed relay could be reconstructed by 3D X- ray microscopy and the abnormity would be located according to the structural contrast, which lay the foundation for the failure location.