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A Fivefold Increase In Cell Density Sets The New Milestone In TrenchFETreg; Device Performance

机译:细胞密度的五倍增加在Trenchfet®设备性能中设置了新的里程碑

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Throughout the last decade we have witnessed the advent of the portable electronic device and in so, observed the evolution of battery operated power management systems. Significant demands are now applied to the solid state switching elements of such systems, effectively pushing the silicon performance to its maximum limit. To this effect the industry's best power devices are falling short of the performance criteria, with today's best silicon technology not exhibiting all the characteristics sufficient enough to support the calls for low rds(on), improved figure of merit and smaller die size. Focusing on the most common power switch for low voltage applications, the power MOSFET. This paper will highlight and discuss a new proprietary advanced silicon technology that will enable a new generation of ground breaking MOSFET devices to be produced that will help satisfy the latest demands for ever more efficient power management and power conversion systems. This improved process has allowed the increase of TrenchFET® cell density by fivefold.
机译:在过去十年中,我们目睹了便携式电子设备的出现,因此,观察了电池供电系统的演变。现在,需要显着的需求对这种系统的固态开关元件,有效地将硅性能推向其最大限制。为此效力,行业的最佳功率设备缺乏性能标准,随着当今最好的硅技术,没有足够的所有特性,以支持低RDS(开启)的呼叫,改善的优点和更小的模具。专注于低电压应用的最常见电源开关,功率MOSFET。本文将突出和讨论新的专有先进硅技术,使得能够产生新一代的地面破坏MOSFET器件,这将有助于满足更高效的电源管理和电力转换系统的最新需求。这种改进的过程允许通过五倍增加Trenchfet®细胞密度。

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