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AC Breakdown Performance of Non-isothermally Crystallized Polyethylene/Silicon Nitride Nanocomposites

机译:非等温结晶聚乙烯/氮化硅纳米复合材料的交流击穿性能

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Polymer nanocomposites has a huge potential to serve as dielectric materials. These materials were found to have a great capability in withstanding high voltage levels. In nanocomposites development, the breakdown strength of the materials was often reported to be higher, lower or similar, in comparison with the unfilled polymer. Because of this, the breakdown performance of nanocomposites is said to be dependent not only on the polymeranofiller combination, but also on the sample preparation techniques. Unfortunately, factors leading to increased or decreased the breakdown strength of nanocomposites are less understood. In this paper, investigation into polyethylene blend systems that contain different amounts of silicon nitrite nanofiller with different non-isothermal crystallization processes was reported. The non-isothermal crystallization techniques were determined by fast, medium and slow cooling rate conditions while preparing the samples. Differential scanning calorimetry (DSC) was used to characterize the thermal behavior of the polymer nanocomposites. The AC breakdown data showed that the use of different non-isothermal crystallization techniques affected the AC breakdown strength of each material type.
机译:聚合物纳米复合材料具有巨大的潜力,可以用作介电材料。发现这些材料具有承受高压水平的强大能力。在纳米复合材料的开发中,与未填充的聚合物相比,经常报告该材料的击穿强度更高,更低或相似。因此,据说纳米复合材料的分解性能不仅取决于聚合物/纳米填料的组合,还取决于样品制备技术。不幸的是,导致纳米复合材料击穿强度增加或降低的因素鲜为人知。在本文中,对含不同亚硝酸硅纳米填料且具有不同非等温结晶过程的聚乙烯共混体系进行了研究。在制备样品时,通过快速,中速和慢速冷却条件确定非等温结晶技术。差示扫描量热法(DSC)用于表征聚合物纳米复合材料的热行为。交流击穿数据表明,使用不同的非等温结晶技术会影响每种材料类型的交流击穿强度。

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