A New Multi-Stimuli-Based Simulation Method for ESD Design Verification

摘要

This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD simulation using either HBM waveforms or TLP pulse trains, alone, is insufficient. We introduce a new mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design prediction, which was validated in 28nm bulk CMOS and 45nm SOI CMOS.