3D Monolithic Metal Orifice Plate for SERS Application: A Showcase of Low Cost MEMS Packaging

摘要

Electroplating is a low cost process where metal ions in a solution are reduced by an applied electric field onto a conductive substrate. This process has been studied extensively, but is still critical for modern technology and R&D. In the HP inkjet printing business, electroplating is primarily used in the manufacturing the orifice plate (OP) for integrated print-head products. To extend the OP functionality, a novel cost-effective three-dimensional (3D) OP has been developed to address numerous micro-electro-mechanical systems (MEMS) applications, including surface enhanced Raman spectroscopy (SERS).