Simultaneous front and back side Cu metallization on power chips: DP: Discrete and power devices or ET/ID: Enabling technologies and innovative devices

摘要

This article describes a new tool and process for Cu electroplating on power chips. The tool enables a new, more efficient method for embedding power chips by means of simultaneous electroplating on both sides of the wafer. Additional tool features, to be discussed in this article, provide technical benefits for embedded technologies and enable further miniaturization of power chip packages to comply with future requirements and products.