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Chasing ghosts: How an SRAM detected the subtle impact of stray light

机译:追逐幽灵:SRAM如何检测杂散光的细微影响

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The ever-shrinking world of semiconductors has always challenged the interplay of tool capability, process integration, and characterization. The fine line between structural or electrical success and failure has steadily been redefined from microns to nanometers with leading edge technology using terms with the likes of angstroms and layers of atoms. Failure modes at these nodes become increasing difficult at times to even grasp, let alone “visualize” with electrical and physical analytical techniques. The complexity of these state-of-the-art problem sets demand adaptive and robust problem solving methodologies tailored to uncover and drive root cause understanding. Assembling and organizing diverse teams covering a broad range of expertise becomes paramount. In this case study, we were able to make use of a unique low voltage static random access memory fail mode and spatial fingerprint to chase down a 1 nanometer change in transistor gate line widths; the sleuthing effort concluded with the unlikely combination of mask chrome frame and stray light from lithography as the ultimate root cause.
机译:不断缩小的半导体世界一直在挑战工具功能,工艺集成和特性描述之间的相互作用。通过领先的技术,使用诸如埃和原子层之类的术语,已将结构性或电气性成功与失败之间的精细界限稳步地从微米重新定义为纳米。这些节点的故障模式有时甚至变得越来越难以掌握,更不用说用电气和物理分析技术来“可视化”了。这些最新的问题集的复杂性要求自适应的,健壮的问题解决方法能够适应发现和推动根本原因理解的需求。组建和组织涵盖广泛专业知识的多样化团队变得至关重要。在本案例研究中,我们能够利用独特的低电压静态随机存取存储器故障模式和空间指纹来追踪晶体管栅极线宽的1纳米变化。侦查工作的最终结果是将掩模镀铬框架和光刻的杂散光组合为最终的根本原因。

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