首页> 外文会议>International Conference on Solid-State Sensors, Actuators and Microsystems >High temperature coefficient of resonant frequency induced by thermal stress using a double-supported mechanical resonator with a simple structure for highly thermal sensing
【24h】

High temperature coefficient of resonant frequency induced by thermal stress using a double-supported mechanical resonator with a simple structure for highly thermal sensing

机译:使用具有简单结构的双支撑机械谐振器,由热应力引起的谐振频率的高温系数较高,该结构简单,可实现高度热感应

获取原文

摘要

A resonant frequency changes of some shape double-supported mechanical resonators are investigated for highly sensitive thermal measurement using resonant sensors. Thermal stress of resonators, which depends on the shape, has large effects to the temperature coefficient of resonant frequency (TCRF). The resonant frequency changes of Y, I, T, shape double-supported resonators are experimentally evaluated changing the temperature, and compared with the theoretical thermal stress change. The Y shape resonator is most effective shape to increase TCRF due to the large thermal stress, and the value is −650 ppm/K. The experimental resonant frequency change and theoretical thermal stress have a good agreement, which contribute to estimate the TCRF of the double-supported resonators.
机译:为了使用共振传感器进行高度灵敏的热测量,研究了某些形状双支撑机械共振器的共振频率变化。谐振器的热应力取决于形状,对谐振频率的温度系数(TCRF)具有很大的影响。 Y,I,T形双支撑谐振器的谐振频率变化通过温度变化进行实验评估,并与理论热应力变化进行比较。由于大的热应力,Y形谐振器是提高TCRF的最有效形状,其值为-650 ppm / K。实验谐振频率变化与理论热应力具有良好的一致性,有助于估算双支撑谐振器的TCRF。

著录项

相似文献

  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号