Multi-sensor platform LSI enabling different sensors to be event-driven and connected to common differental bus line

摘要

This paper presents a multi-sensor platform LSI for versatile applications including next generation robots. For a unified system implementation, the proposed LSI, which was fabricated by TSMC0.13μm CMOS process and whose size is 2.83mm × 2.83mm, provides the following functions: several principle sensor readout circuits, 8-single or 4-differential multi-channels for multi-axis sensing, digital outputs as a haptic driver controller, flexible system parameter configuration, a RS485 compatible differential signal serial bus communication method, and event-driven response. This LSI has unique structures for MEMS-CMOS chip scale integration. We proved the sensor platform functions with experiments.