Yield-driven redundant power bump assignment for power network robustness

摘要

During package manufacturing process, open defects of power bumps may cause insufficient power supply and degrade the power network yield. This work presents a redundant power bump insertion method to ensure power integrity by considering the power bump yields. The proposed method can efficiently assign redundant bumps by accurately estimating the location of worst load yield and minimizing the amounts of redundant bumps to enhance the power network yield.