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Towards a Formal Ontology to Support Interoperability Across Multiple Product Lifecycle Domains

机译:建立一种正式的本体以支持跨多个产品生命周期域的互操作性

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The advancements in computer systems have led to the replacement of various traditional manual manufacturing activities with Information & Communication Technology (ICT) tools. In a highly competitive world, it is imperative for different manufacturing systems to have interoperability in order to aid better, faster and cheaper production. However, different manufacturing domains have different data structures, syntaxes and semantics which lead to problems in interoperability and knowledge sharing. Interoperability issues can potentially be resolved if a computationally interpretable ontology can provide a basis for common understanding across different manufacturing domains. Although researchers have proposed manufacturing ontologies, the number of manufacturing domains addressed and the formalization have been limited. Research work is required to develop a formal core manufacturing ontology that supports various product lifecycle domains. This paper proposes a formal Product Lifecycle Ontology (PLO) to facilitate interoperability across multiple product lifecycle domains. The proposed ontology is semantically enriched comprising of core concepts, relations and axioms. The ontology is aimed at supporting interoperability not only across different manufacturing domains but also across different time frames. The proposed ontology contributes towards a reference manufacturing ontology that expands previous works and fills in the research gaps that exist within the area of formal manufacturing reference ontologies.
机译:计算机系统的进步导致用信息和通信技术(ICT)工具取代了各种传统的手工制造活动。在竞争激烈的世界中,不同的制造系统必须具有互操作性,以帮助更好,更快和更便宜的生产。但是,不同的制造域具有不同的数据结构,语法和语义,从而导致互操作性和知识共享方面的问题。如果可计算解释的本体可以为跨不同制造领域的共识提供基础,则可以潜在地解决互操作性问题。尽管研究人员提出了制造本体论,但所涉及的制造领域和形式化的数量仍然有限。需要进行研究工作,以开发支持各种产品生命周期领域的正式核心制造本体。本文提出了一种正式的产品生命周期本体(PLO),以促进跨多个产品生命周期域的互操作性。所提议的本体在语义上得到了丰富,包括核心概念,关系和公理。本体旨在不仅支持跨不同制造领域而且跨不同时间范围的互操作性。拟议的本体为参考制造本体做出了贡献,该本体扩展了先前的工作并填补了正式制造参考本体领域内存在的研究空白。

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