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Design of ring oscillator with better temperature, supply voltage process stability with 32nm FDSOI transistor for ISM band application

机译:用于ISM频段应用的32nm FDSOI晶体管设计具有更好的温度,电源电压和工艺稳定性的环形振荡器

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Nowadays, the development of VLSI technology mainly directed towards the minimization of semiconductor devices which is heavily dependent on the advancement in CMOS technology. The minimum dimension of single devices in present day's technology is below 100nm in channel length. As CMOS technology dimension is aggressively being scaled down, there are certain limitations on how small a transistor can be developed with conventional CMOS techniques. Hence the transistors are developed with different alternative techniques to overcome these limitations as MUGFET, FINFET & FDSOI techniques. This paper is focused on design of ring oscillator with 32nm conventional CMOS transistor & with 32nm FDSOI transitory in HSpice software. With ring oscillator designed using FDSOI(Fully depleted silicon on insulator) transistor has 400% better supply voltage stability, 200% better process (Gate length) stability & nearly an ideal performance for temperature variation range from 0°C to 125°C as compare with conventional CMOS transistor.
机译:如今,VLSI技术的发展主要针对半导体器件的最小化,而这在很大程度上取决于CMOS技术的发展。当今技术中,单个器件的最小尺寸是通道长度在100nm以下。随着CMOS技术尺寸的不断缩小,利用常规CMOS技术可以开发出多小的晶体管存在一定的局限性。因此,晶体管采用不同的替代技术来开发,以克服MUGFET,FINFET和FDSOI技术的这些局限性。本文重点研究HSpice软件中具有32nm常规CMOS晶体管和32nm FDSOI瞬态的环形振荡器的设计。使用FDSOI(绝缘体上完全耗尽的硅)晶体管设计的环形振荡器具有400%的电源电压稳定性,200%的工艺(栅极长度)稳定性以及相较于0°C至125°C的温度变化范围近乎理想的性能与常规CMOS晶体管配合使用。

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