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Evaluating the efficiency of using TMR in the high-level synthesis design flow of SRAM-based FPGA

机译:在基于SRAM的FPGA的高级综合设计流程中评估使用TMR的效率

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Triple Modular Redundancy (TMR) is the most widely used technique to increase the reliability of SRAM-based FPGAs. In this paper, we investigate the application of TMR directly in C language-based algorithms to be synthesized using High Level Synthesis (HLS) to generate hardened Register Transfer Level (RTL) designs. We analyze four different TMR designs implemented into a 28 nm SRAM-based FPGA from Xilinx. Fault injection campaigns were performed aiming to analyze the probability of errors in those hardened architectures. We compare the information of essential bits delivered by the vendor with the critical bits provided by fault injection. Results show that the TMR technique applied at HLS level is capable of efficiently mask errors, reducing the number of critical bits by 30 times on average. Concerning TMR designs, the area overhead is 2.4 times on average, while performance overhead is 2.0 times when pipeline optimization is used.
机译:三重模块冗余(TMR)是用于提高基于SRAM的FPGA可靠性的最广泛使用的技术。在本文中,我们研究了TMR在基于C语言的算法中的应用,该算法使用高级综合(HLS)进行综合以生成强化的寄存器传输级(RTL)设计。我们分析了Xilinx在基于28 nm SRAM的FPGA中实现的四种不同的TMR设计。进行了故障注入活动,旨在分析那些硬化架构中的错误概率。我们将供应商提供的基本位信息与故障注入提供的关键位信息进行比较。结果表明,应用于HLS级别的TMR技术能够有效掩盖错误,平均将关键位的数量减少30倍。关于TMR设计,使用管道优化时,面积开销平均为2.4倍,而性能开销为2.0倍。

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