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Comparison of E-mode GaN HEMT Using Different Gate Oxide Stack Approach

机译:使用不同栅极氧化物堆叠方法的E型GaN HEMT的比较

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In this study, three different types of gate recessed E-mode GaN MIS-HEMTs were fabricated by different gate oxide stack techniques. The gate oxide stacks were designed with different oxide potential barrier, resulting in the device with different threshold voltages. Each device performance was evaluated, compared and discussed. The proposed device with charge trap gate stack showed the best device performance with high threshold voltage and high maximum drain current density in this work.
机译:在这项研究中,通过不同的栅极氧化物堆叠技术制造了三种不同类型的栅极凹陷的E型GaN MIS-HEMT。栅极氧化物叠层被设计为具有不同的氧化物电势垒,从而导致器件具有不同的阈值电压。评估,比较和讨论了每种设备的性能。带有电荷陷阱栅叠层的拟议器件在这项工作中显示出最佳的器件性能,具有高阈值电压和高最大漏极电流密度。

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