Temperature distribution during the phase change in the volume of the solder alloy

摘要

Solder is usually an alloy of two and more metals. Very often is used tin, lead, copper, silver, bismuth, nickel, etc. for its production. If the alloy is exposed to a sufficiently high temperature, it is induced phase change from solid to liquid phase for it. Phase is changed again from liquid to solid during cooling substance. At this point, the substance generates a latent heat that is manifests differently for each alloy. Each component contributes its thermal and conductivity parameters into the overall properties of the alloy. The result determines quantity of the generated latent heat. And by final amount of the temperature acts on their surroundings. There have been several experimental measurements for determining of decomposition of temperature in a volume of electrically conductive solder joints during a phase change (from liquid to solidstate). Measurements were carried out on the reference alloy Sn-Pb (eutectic) and three lead-free solder alloys.