Influence of geometry on the applied solder paste in technology Pin in Paste(PiP)

摘要

PiP (Pin in Paste) is a technology for soldering with the least expenses and high quality because it is carried out fast (in one step for all components) and without human intervention. In the report it is shown the influence of geometry of the laid paste on the quality of soldering. It is examined in what geometry and in what ways of laying a reliable and repeated soldering can be achieved. There are some rules for successful laying of solder paste which are fixed by the experiments. The most important conclusions are: after a precise estimation of the quantity of paste for every point of soldering it is necessary to define the type, the dimensions and the place of the figure of the laid paste on PCB, which is connected to the design of the stencil's aperture, the place of laying of PCB, the way of laying and the qualities of the solder paste. Some producers of pastes for soldering created and offer special designed pastes for PiP. This process is used by EMS (electronic manufacturing services) producers more and more, especially by decreasing the dimensions of the components and increasing the degree of integration. More and more producers of electronic components offer such ones for PiP technology.