UV laser based direct structuring

摘要

Conventional continuous wave and long pulse (nanosecond) laser ablation is used in many fields, such as direct PCB structuring process. In this regimes the dominant process involved is the heating of the target material through the liquid phase to the vapour phase, resulting in expansion and expulsion of the desired target material. Frequency-tripled UV Nd:YAG laser spot is used at focal point, however we can conveniently change the power, pulse repetition rate and beam scanning speed to get optimum surface energy density for selective material removing.