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The effect of ceramic metallization process on the performance of vacuum interrupter

机译:陶瓷金属化工艺对真空灭弧室性能的影响

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The effect of ceramic metallization process on the performance of vacuum interrupter was researched by X-ray thickness test, metallographic analysis, tensile strength test and air tightness test. Electroplating Ni and coating Ni metallization processes were used in this research. The thickness of electroplating Ni is 3.5μm-6μm, and that of coating Ni is 4μm-6μm. The Ni layers of electroplating Ni and coating Ni are both continuous, but electroplating Ni is not uniform. A little Ni layer can be seen from electroplating Ni ceramic after vacuum brazing. The tensile strength difference of standard tensile pieces between them is little. The air tightness difference of vacuum interrupter between them is not obvious.
机译:通过X射线厚度试验,金相分析,抗拉强度试验和气密性试验研究了陶瓷金属化工艺对真空灭弧室性能的影响。本研究使用电镀镍和镀镍金属化工艺。电镀Ni的厚度为3.5μm-6μm,镀覆Ni的厚度为4μm-6μm。电镀Ni和涂层Ni的Ni层都是连续的,但是电镀Ni是不均匀的。从真空钎焊后的电镀镍陶瓷中可以看到少量的镍层。它们之间的标准拉伸件的拉伸强度差很小。它们之间的真空灭弧室的气密性差异不明显。

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