Novel IGBT modules with epoxy resin encapsulation and insulating metal baseplate

摘要

A newly IGBT module combined with liquid epoxy resin encapsulation and insulating metal baseplate (IMB) has been developed. IMB is insulating sheet with thick baseplate, and has large mounting area compared to ceramic substrate. The properties of liquid epoxy resin such as glass transition temperature, coefficient of thermal expansion, long-term thermostability are optimized for employed metal baseplate. Developed structure reduces solder cracks under semiconductor chip, and enhances lifetime of heat cycle test.