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Transient micropackets for silicon dioxide and polymer-based vaporizable electronics

机译:用于二氧化硅和聚合物基可蒸发电子产品的瞬态微包

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We report, for the first time, arrayable self-contained transient micropackets as building blocks to realize vaporizable electronics. Transience is controlled by a one-shot micro-valve, with 2.2 mJ trigger energy, 15.4 msec trigger-time and 100% triggering yield, which exposes nanoliter reactive rubidium droplets to air. The oxygen in air oxidizes the rubidium exothermically, generating heat that vaporizes the low-temperature degradable polymer substrate, which forms the substrate for the packets. Here we also demonstrate micro-packets of sodium biflouride (NaHF2), which decomposes on heating to etch 1 μm oxide electronics substrate in 1 minute. With co-packaging of rubidium and NaHF2, we demonstrate a pathway to fully transient packaged electronics.
机译:我们首次报告了可阵列的独立瞬态微包,作为实现可蒸发电子产品的基础。瞬变由一个单发微阀控制,触发能量为2.2 mJ,触发时间为15.4毫秒,触发产率为100%,将纳升反应性droplet液滴暴露在空气中。空气中的氧气将the放热地氧化,产生的热量使低温可降解的聚合物基材汽化,从而形成了包装的基材。在这里,我们还演示了氟化氢钠(NaHF2)的微包,该微包在加热后会分解,以在1分钟内蚀刻出1μm的氧化物电子衬底。通过co和NaHF2的共包装,我们展示了通向完全瞬态封装电子产品的途径。

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