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Innovative fault isolation analysis technique to identify failure mechanism on recovering device failure

机译:创新的故障隔离分析技术,可在恢复设备故障时识别故障机理

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Failure analysis (FA) plays an important role in the semiconductor industry as the process technology and new packaging is continuously improved. Missed out failure mechanisms and device recovery is a growing challenge in the FA field. In this paper, a new FA method is presented. A precise backside Fault Isolation was utilized in combination with Cross-section and Focused Ion Beam to uncover the Failure mechanism. The application of this method will be discussed on two case studies with different failure mechanisms.
机译:随着工艺技术和新包装的不断改进,失效分析(FA)在半导体行业中起着重要作用。在FA领域,错过的故障机制和设备恢复是日益严峻的挑战。本文提出了一种新的FA方法。将精确的背面故障隔离与横截面和聚焦离子束结合使用,以揭示故障机理。将在两个具有不同故障机制的案例研究中讨论该方法的应用。

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