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Large-grain Sn-doped Ge (100) on insulator by aluminum-induced crystallization at low-temperature for flexible electronics

机译:绝缘体上铝诱导的低温晶化在绝缘体上的大晶粒掺锡Ge(100),用于柔性电子产品

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A low-temperature formation technique of Sn-doped Ge on insulator has been investigated by aluminum-induced crystallization using a-GeSn/Al stacked structures. For a-GeSn films (Sn concentration: 2%), the layer-exchange growth temperature is significantly decreased compared with a-Ge, which enables low temperature growth at 250°C. At such a low temperature, bulk nucleation of GeSn in Al layers is significantly suppressed, and (100)-oriented interface nucleation becomes dominant. On the other hand, growth rate becomes high by Sn-doping effects. As a result, formation of (100)-oriented large-grain (>10 μm) Sn-doped Ge (Sn concentration: 2%) crystals on insulating substrates becomes possible at a low temperature (250°C). This technique will be useful to realize advanced flexible electronics.
机译:已经通过使用a-GeSn / Al堆叠结构的铝诱导结晶研究了绝缘体上掺Sn的Ge的低温形成技术。对于a-GeSn膜(Sn浓度:2%),与a-Ge相比,层交换生长温度显着降低,从而可以在250°C低温生长。在这样的低温下,显着抑制了Al层中GeSn的整体成核,并且(100)取向的界面成核变得占优势。另一方面,通过Sn掺杂效应,生长速率变高。结果,在低温(250℃)下在绝缘基板上形成(100)取向的大晶粒(>10μm)的Sn掺杂的Ge(Sn浓度:2%)晶体成为可能。该技术对于实现先进的柔性电子设备将很有用。

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