首页> 外文会议>IEEE Electronics Packaging Technology Conference >Creep corrosion on uppf lead frame package caused by packing materials
【24h】

Creep corrosion on uppf lead frame package caused by packing materials

机译:包装材料导致uppf引线框封装的蠕变腐蚀

获取原文

摘要

A NiPdAu-Ag leadframe package was reported with creep corrosion which leads to soldering failure. The DOE experiments narrow down the failure root cause related to the PVC tube packaging material and plating variance. The finding confirms that the corrosion is cause by the PVC black tube releasing chloride vapour during transporting process.
机译:据报道,NiPdAu-Ag引线框封装具有蠕变腐蚀,从而导致焊接失败。 DOE实验缩小了与PVC管包装材料和电镀差异有关的故障根本原因。该发现证实了腐蚀是由PVC黑管在运输过程中释放氯气蒸气引起的。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号