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Studies on Failure Mechanism of Al Fluoride Oxide-AlxOyFz on Microchip Al Bondpads

机译:Al氟化物氧化物-Alxoyfz对Microchip Al Bondpads的失效机理研究

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Al fluoride oxide on microchip Al bondpads may cause non-stick on pad (NSOP) problem during bonding process. In this study, a failure mechanism to form Al fluoride oxide-AlxOyFz has been proposed. Based on the failure mechanism, F contamination on Al bondpads, it will chemically react with Al and form Al-F complex compound, such as [AlF6]3. [AlF6]3- formed may become an anode and further chemical reaction from O2 and moisture (H2O) will occur at the cathode and form the new product, OH-ions, which will undergo chemical reaction with Al to form Al(OH)3, and then become Al2O3. Finally, Al-F complex compound may further chemically react with Al2O3 to form Al fluoride oxide-AlxOyFz.
机译:在微芯片Al键合方面的Al氟化物氧化物可能在粘合过程中导致垫(NSOP)问题上的不粘。在该研究中,提出了形成Al氟化物-Alxoyfz的失效机制。基于故障机制,在Al键合剂上的F污染,它将与Al化学反应并形成Al-F复合化合物,例如[AlF6] 3。 [Alf6] 3-形成的可能变成阳极,并且在阴极上发生来自O 2和水分(H 2 O)的进一步的化学反应,并形成新产物,OH-离子,其将与Al进行化学反应以形成Al(OH)3 ,然后成为Al2O3。最后,Al-F复合化合物可以与Al 2 O 3进一步化学反应以形成Al氟化物氧化物-Alxoyfz。

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