An FIB Method Using Progressive Multi-Cut Technique Application in Failure Analysis of Wafer Fabrication

摘要

In this paper, an FIB method using progressive multi-cut technique is proposed and it has been applied in failure analysis of wafer fabrication. The application results showed that this method would greatly improve FIB cut success rate, especially for invisible defects. A case study on Vbd ramp up failure after QBD short loop will be presented.